| Last fall, Sal was repairing a ROC board, and noted regions that clearly had overheated. | 
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| closeup A | 
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| closeup B | 
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| closeup C | 
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This sketch shows a cooling element, a semi-circle covering the FPGAs, which is where most of the heat is generated. It is screwed down using the screw holes which are already in the ROCs (red dots). The cooling element is a slab of Aluminum, 6-8mm thick, with a fluid channel milled in, and with an Aluminum skin brazed on. Of course there is thermal paste between the FPGAs and the cooling element. | 
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Hubert Van Hecke Last modified: Tue May 14 23:42:04 EDT 2013